Wykamol High Load Thermal Insulation Boards are designed for basement waterproofing systems and below-ground applications where thermal performance, moisture resistance and compressive strength are essential.
With a 50mm thickness and a design thermal conductivity of 0.034 W/mK, these boards provide effective thermal insulation for suitable basement and below-ground construction projects. Their high compressive strength makes them suitable for applications where insulation must withstand significant loads, subject to the project specification.
The boards feature a 15mm shiplap edge to help achieve a closer fit between adjoining boards and are designed for use within compatible waterproofing and insulation systems.